Method for polish rate control

A polishing method includes: receiving a semiconductor substrate onto a polishing head over a polishing pad that comprises a first region and a second region, wherein the first region comprises a first set of properties related to a first pad surface pattern, the first set of properties corresponds...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSIAO, HAU-YI, CHEN, SHENGAU, WU, KUO-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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