Method for polish rate control

A polishing method includes: receiving a semiconductor substrate onto a polishing head over a polishing pad that comprises a first region and a second region, wherein the first region comprises a first set of properties related to a first pad surface pattern, the first set of properties corresponds...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HSIAO, HAU-YI, CHEN, SHENGAU, WU, KUO-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A polishing method includes: receiving a semiconductor substrate onto a polishing head over a polishing pad that comprises a first region and a second region, wherein the first region comprises a first set of properties related to a first pad surface pattern, the first set of properties corresponds to a first polishing rate for a first portion of the semiconductor substrate during a polishing operation using the polishing pad, the second region comprises a second set of properties related to a second pad surface pattern, the second set of properties corresponds to a second polishing rate for a second portion of the semiconductor substrate during the polishing operation, and the second set of properties is different from the first set of properties; and polishing the semiconductor substrate using the polishing pad.