Method for polish rate control

Method for polish rate control

A polishing method includes: receiving a semiconductor substrate onto a polishing head over a polishing pad that comprises a first region and a second region, wherein the first region comprises a first set of properties related to a first pad surface pattern, the first set of properties corresponds...

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Hauptverfasser: HSIAO, HAU-YI, CHEN, SHENGAU, WU, KUO-MING
Format: Patent
Sprache:chi ; eng
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DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator HSIAO, HAU-YI
CHEN, SHENGAU
WU, KUO-MING
description A polishing method includes: receiving a semiconductor substrate onto a polishing head over a polishing pad that comprises a first region and a second region, wherein the first region comprises a first set of properties related to a first pad surface pattern, the first set of properties corresponds to a first polishing rate for a first portion of the semiconductor substrate during a polishing operation using the polishing pad, the second region comprises a second set of properties related to a second pad surface pattern, the second set of properties corresponds to a second polishing rate for a second portion of the semiconductor substrate during the polishing operation, and the second set of properties is different from the first set of properties; and polishing the semiconductor substrate using the polishing pad.
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Method for polish rate control
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