Bonding structure for connecting a chip and metal and manufacturing method thereof

A bonding structure for connecting a chip and metal, and a manufacturing method thereof are provided. The bonding structure includes a substrate, a chip, a metal piece, at least one metal wire and an alloy connection layer. The upper surface of the substrate has a first metal pad and a second metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, YAN-WEI, CHIU, ZZUI, CHAO, WEIUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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