Bonding structure for connecting a chip and metal and manufacturing method thereof

A bonding structure for connecting a chip and metal, and a manufacturing method thereof are provided. The bonding structure includes a substrate, a chip, a metal piece, at least one metal wire and an alloy connection layer. The upper surface of the substrate has a first metal pad and a second metal pad. The chip is disposed on the first metal pad. The metal piece is disposed above the wafer. The at least one metal wire has a first end and a second end, the first end is connected to the upper surface of the metal piece, and the second end is connected to the second metal pad. The alloy connection layer is connected between the metal piece and the chip, and covers at least a part of the lower surface of the metal piece.