Electronic devices and methods of manufacturing electronic devices

In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant o...

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Bibliographische Detailangaben
Hauptverfasser: KI, WON-MYOUNG, KIM, SOO-HYUN, HWANG, TAE-KYEONG, HAN, DONG-HOON
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component, and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure comprises a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends above the upper dielectric layer. Other examples and related methods are also disclosed herein.