Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor devices and methods of manufacturing semiconductor devices

In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: RYU, DONG-SU, NA, SEOK-HO, BAE, JO-HYUN, KONG, MIN-JAE, KANG, DONG-HEE, CHOI, WON-HO, KHIM, JIN-YOUNG, BAE, JAE-YEONG, KIM, YUN-AH, PARK, DONG-HYEON
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.