Thermally conductive silicone composition

The present invention is a thermally conductive silicone composition characterized by comprising: 100 parts by mass of an (A) component, an organopolysiloxane represented by general formula (1); 2-100 parts by mass of a (B) component, a diorganopolysiloxane having silicon-atom-bonded hydroxyl and/or hydrolyzable silyl groups at both ends of the molecular chain and having a kinematic viscosity at 25 DEG C of 5-10,000 mm2/s; 10-250 parts by mass of a (C) component, an organopolysiloxane which is neither the (A) component nor the (B) component and which is represented by general formula (4) R5 dSiO(4-d)/2 and has a kinematic viscosity at 25 DEG C of 100-100,000 mm2/s; and a (D) component, a thermally conductive filler having a thermal conductivity of 10 W/m. DEG C or greater, the amount of the (D) component being 500-3,000 parts by mass relative to 100 parts by mass of the sum of the (A), (B), and (C) components. It is thus possible to provide a thermally conductive silicone composition that requires no special