Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board

Provided are: a photosensitive resin composition that has excellent via resolution, adhesive strength to plated copper, crack resistance, and electrical insulation reliability; a photosensitive resin composition for forming photo vias; and a photosensitive resin composition for interlayer insulating...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKADE, SHOTA, NOMOTO, SHUJI, SUZUKI, YOSHIKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are: a photosensitive resin composition that has excellent via resolution, adhesive strength to plated copper, crack resistance, and electrical insulation reliability; a photosensitive resin composition for forming photo vias; and a photosensitive resin composition for interlayer insulating layers. Also provided are a photosensitive resin film comprising a photosensitive resin composition and a photosensitive resin film for interlayer insulation layers. In addition, a multilayer printed wiring board and a semiconductor package are provided, as well as a production method for the multilayer printed wiring board. Specifically, the photosensitive resin composition contains a photopolymerizable compound (A) having an ethylenically unsaturated group and a photopolymerization initiator. The photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound that has an ethylenically unsaturated group (A1), an acidic substituent, and an alicyclic skeleton.