Cover tape for packaging electronic components and electronic component package

This cover tape for packaging electronic components is provided with a base material layer, a first intermediate layer, a second intermediate layer, and a sealant layer in the stated order. In the cover tape, the first intermediate layer contains a polyethylene-based resin derived from biomass, and...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ABE, HIROKI, MASUI, KEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This cover tape for packaging electronic components is provided with a base material layer, a first intermediate layer, a second intermediate layer, and a sealant layer in the stated order. In the cover tape, the first intermediate layer contains a polyethylene-based resin derived from biomass, and the second intermediate layer contains a polyethylene-based resin having a density of 0.908 g/cm3 or less.