Power electronics package with dual-single side cooling water jacket

Power electronics package with dual-single side cooling water jacket

A package includes a frame having a cooling fluid channel therethrough. The frame has at least one opening in a first sidewall alongside the cooling fluid channel and at least one opening in a second sidewall alongside the cooling fluid channel. A first power electronics module covers the at least o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, YOON-SOO, IM, SEUNG-WON, JEON, O-SEOB
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package includes a frame having a cooling fluid channel therethrough. The frame has at least one opening in a first sidewall alongside the cooling fluid channel and at least one opening in a second sidewall alongside the cooling fluid channel. A first power electronics module covers the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall, and a second power electronics module covers the at least one opening in the second sidewall with a surface of a substrate in the second electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.