Adhesive tape for electronic components

The purpose of the present invention is to provide an adhesive tape for electronic components, which is capable of being bonded with sufficient followability even to a thick and hard wafer that has a level difference in the surface, and is expanded so that the wafer can be satisfactorily divided into chips. Provided is an adhesive tape 1 for electronic components, in which an adhesive layer 3 is formed on at least one surface of a base material film 2. The adhesive tape 1 for electronic component is characterized in that: the adhesive layer 3 is a radiation curable adhesive layer 3 which is cured by being irradiated with radioactive ray; the total thickness of the base material film 2 and the adhesive layer 3 is 170 [mu]m or less; and in a tensile test in accordance with JIS K7161-2 (2014) in the TD direction of a multilayer body composed of the base material film 2 and the adhesive layer 3 after being irradiated with radioactive ray, the formula B (N) - A (N) > 0 (N) is satisfied, wherein A represents a load