Substrate processing apparatus and substrate processing method
The present invention provides a substrate processing apparatus. The substrate processing apparatus for processing a substrate may comprise: a chamber which has a processing space; a chuck which supports a substrate in the chamber; a plasma unit which generates plasma to be transferred to the substr...
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| Hauptverfasser: | , , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention provides a substrate processing apparatus. The substrate processing apparatus for processing a substrate may comprise: a chamber which has a processing space; a chuck which supports a substrate in the chamber; a plasma unit which generates plasma to be transferred to the substrate; and an impedance tuning unit which is connected to the chuck, wherein the impedance tuning unit comprises: an inductor; a capacitor; and at least one switch which connects the inductor selectively in series or in parallel to the capacitor. |
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