Laminated structure, method for producing same, cured product, and electronic component

Provided is a laminated structure from which a cured product having a low-roughness surface, excellent plating adhesion, and excellent heat resistance can be formed. The laminated structure according to the present invention comprises a first film, and a resin layer provided on the first film, the l...

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Bibliographische Detailangaben
Hauptverfasser:	NAKA, YUSUKE, NAKADA, KAZUTAKA, AOYAMA, YOSHITOMO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a laminated structure from which a cured product having a low-roughness surface, excellent plating adhesion, and excellent heat resistance can be formed. The laminated structure according to the present invention comprises a first film, and a resin layer provided on the first film, the laminated structure being characterized in that: the resin layer contains (A) an epoxy resin, (B) a polyarylate compound having a bisphenol structure and an ester group, (C) an inorganic filler, and (D) a solvent; the inorganic filler (C) is contained in the resin layer in an amount of 38-82 mass% in terms of the solid content; and the resin layer has a mass reduction rate of at most 3.0 mass% after the resin layer is heated for 20 minutes at 100 DEG C under atmospheric pressure.