Carrying substrate
A carrier substrate is provided and having a first wiring structure and a second wiring structure on opposite sides thereof, wherein on one wiring area, a difference between the wiring ratio of the first wiring layer of the first wiring structure and that of the second circuit layer of the second wi...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A carrier substrate is provided and having a first wiring structure and a second wiring structure on opposite sides thereof, wherein on one wiring area, a difference between the wiring ratio of the first wiring layer of the first wiring structure and that of the second circuit layer of the second wiring structure is within 10%. Therefore, a difference in the wiring ratio of the two outermost wiring layers of the carrier substrate in the specific target area can be reduced, so as to avoid a warping of the carrier substrate due to a larger difference in a metal distribution area. |
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