Cupped baffle plates for showerheads of substrate processing systems

A cupped baffle plate for a showerhead of a substrate processing system includes: a baseplate to be disposed in a plenum of the showerhead to receive a fluid from a stem of the showerhead, the baseplate includes holes to receive standoff elements for coupling the baseplate to at least one of a backp...

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Bibliographische Detailangaben
Hauptverfasser:	ARCURI, CONOR CHARLES, BORTH, ANDREW
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A cupped baffle plate for a showerhead of a substrate processing system includes: a baseplate to be disposed in a plenum of the showerhead to receive a fluid from a stem of the showerhead, the baseplate includes holes to receive standoff elements for coupling the baseplate to at least one of a backplate or a faceplate of the showerhead; and a circumferential lip on the baseplate and adjacent to an outer peripheral edge of the baseplate. The circumferential lip restricts fluid flow over a peripheral edge of the cupped baffle plate.