Curing agent composition and curable composition including the same

The disclosure provides a curing agent composition and a curable composition including the same. A curing agent composition includes: a first compound represented by Formula 1 wherein n=1; and a second compound represented by Formula 1 wherein n=2, wherein the curing agent composition shows high dec...

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Bibliographische Detailangaben
Hauptverfasser:	SEO, DA-YOUNG, CHUNG, KUN-HO, NAM, SAE-ROM
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The disclosure provides a curing agent composition and a curable composition including the same. A curing agent composition includes: a first compound represented by Formula 1 wherein n=1; and a second compound represented by Formula 1 wherein n=2, wherein the curing agent composition shows high decomposition temperature and excellent solubility, such that uneven curing attributable to partial decomposition of a curing agent when crosslinking under vacuum at a high temperature may be prevented.