Curable resin composition, multilayer structure, cured product and electronic component

The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according to the present invention contains (A) an epoxy resin, (B) a po...

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Bibliographische Detailangaben
Hauptverfasser:	NAKA, YUSUKE, NAKADA, KAZUTAKA, AOYAMA, YOSHITOMO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according to the present invention contains (A) an epoxy resin, (B) a polyarylate compound which has a bisphenol structure and an ester group and (C) an inorganic filler. This curable resin composition is characterized in that: the ratio of the equivalent derived from the content of epoxy groups contained in the (A) epoxy resin to the equivalent derived from the content of ester groups and phenolic hydroxyl groups contained in the (B) polyarylate compound which has a bisphenol structure and an ester group is 0.10 to 1.20; and the content of the (C) inorganic filler is 38% by mass to 82% by mass based on the solid content in this curable resin composition.