Sealing material to provide a glass composition that is essentially free of lead oxide and can be used as a sealing material while maintaining a glassy state at sintering temperatures below 400 DEG C

The objective of the present invention is to provide a glass composition that is essentially free of lead oxide and can be used as a sealing material while maintaining a glassy state at sintering temperatures below 400 DEG C. A sealing glass composition is characterized by the absence of lead oxide....

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA, TAKURO, MAEDA, KOZO, MORITA, YOKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The objective of the present invention is to provide a glass composition that is essentially free of lead oxide and can be used as a sealing material while maintaining a glassy state at sintering temperatures below 400 DEG C. A sealing glass composition is characterized by the absence of lead oxide. When expressed as mole% in terms of oxide conversion, the sealing glass composition contains TeO2: 63-82%, ZnO+CuO: 5-25%, Bi2O3: 0.1-9%, and RO (R is one or more of Mg, Ca, Sr, Ba): 1-15%. It can be used as a sealing material for electronic components such as IC packaging and crystal oscillator packaging.