Computer implemented method for defect recognition in an imaging dataset of a wafer, corresponding computer readable-medium, computer program product and systems making use of such methods
The invention relates to a computer implemented method for defect recognition in an imaging dataset of a wafer in a charged particle beam system (78) comprising an embedded system (50), the method comprising: (i) obtaining an imaging dataset of a wafer; (ii) obtaining model data (44, 44', 44�...
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| creator | SRIKANTHA, ABHILASH KORB, THOMAS |
| description | The invention relates to a computer implemented method for defect recognition in an imaging dataset of a wafer in a charged particle beam system (78) comprising an embedded system (50), the method comprising: (i) obtaining an imaging dataset of a wafer; (ii) obtaining model data (44, 44', 44'') for a model architecture (42) of a machine learning model (40, 40', 40'') for defect recognition in the imaging dataset of the wafer, the model architecture (42) being implemented in the embedded system (50); (iii) transferring the model data (44, 44', 44'') to a programmable memory (48, 48', 48'') of the embedded system (50); (iv) applying the machine learning model (40, 40', 40'') to an imaging dataset of a wafer to recognize defects, comprising executing the embedded system implemented model architecture (46) with the transferred model data (44, 44', 44''). |
| format | Patent |
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KORB, THOMAS</creatorcontrib><description>The invention relates to a computer implemented method for defect recognition in an imaging dataset of a wafer in a charged particle beam system (78) comprising an embedded system (50), the method comprising: (i) obtaining an imaging dataset of a wafer; (ii) obtaining model data (44, 44', 44'') for a model architecture (42) of a machine learning model (40, 40', 40'') for defect recognition in the imaging dataset of the wafer, the model architecture (42) being implemented in the embedded system (50); (iii) transferring the model data (44, 44', 44'') to a programmable memory (48, 48', 48'') of the embedded system (50); (iv) applying the machine learning model (40, 40', 40'') to an imaging dataset of a wafer to recognize defects, comprising executing the embedded system implemented model architecture (46) with the transferred model data (44, 44', 44'').</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240801&DB=EPODOC&CC=TW&NR=202431459A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240801&DB=EPODOC&CC=TW&NR=202431459A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SRIKANTHA, ABHILASH</creatorcontrib><creatorcontrib>KORB, THOMAS</creatorcontrib><title>Computer implemented method for defect recognition in an imaging dataset of a wafer, corresponding computer readable-medium, computer program product and systems making use of such methods</title><description>The invention relates to a computer implemented method for defect recognition in an imaging dataset of a wafer in a charged particle beam system (78) comprising an embedded system (50), the method comprising: (i) obtaining an imaging dataset of a wafer; (ii) obtaining model data (44, 44', 44'') for a model architecture (42) of a machine learning model (40, 40', 40'') for defect recognition in the imaging dataset of the wafer, the model architecture (42) being implemented in the embedded system (50); (iii) transferring the model data (44, 44', 44'') to a programmable memory (48, 48', 48'') of the embedded system (50); (iv) applying the machine learning model (40, 40', 40'') to an imaging dataset of a wafer to recognize defects, comprising executing the embedded system implemented model architecture (46) with the transferred model data (44, 44', 44'').</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjrFOAzEQRK-hQMA_LH0iQRIKShSB-IBIlNFijy8Wt17Luxbi3_g47qQgWpqZYkbz5nL43qvU7miUpU4QFEckgZ80UtJGEQnBqSHoWLJnLZQL8azCYy4jRXY2OGkipk9OaCsK2hqsaolLI_wiGjjy-4S1IOYuq7-kNh0by-KxzzgukezLHGIk_LGsdMPCsB5O5392PVwkngw3Z78abl-eD_vXNaoeZz4HFPjx8La52-y297uHx6ftfzo_e5Jgcg</recordid><startdate>20240801</startdate><enddate>20240801</enddate><creator>SRIKANTHA, ABHILASH</creator><creator>KORB, THOMAS</creator><scope>EVB</scope></search><sort><creationdate>20240801</creationdate><title>Computer implemented method for defect recognition in an imaging dataset of a wafer, corresponding computer readable-medium, computer program product and systems making use of such methods</title><author>SRIKANTHA, ABHILASH ; KORB, THOMAS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202431459A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SRIKANTHA, ABHILASH</creatorcontrib><creatorcontrib>KORB, THOMAS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SRIKANTHA, ABHILASH</au><au>KORB, THOMAS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Computer implemented method for defect recognition in an imaging dataset of a wafer, corresponding computer readable-medium, computer program product and systems making use of such methods</title><date>2024-08-01</date><risdate>2024</risdate><abstract>The invention relates to a computer implemented method for defect recognition in an imaging dataset of a wafer in a charged particle beam system (78) comprising an embedded system (50), the method comprising: (i) obtaining an imaging dataset of a wafer; (ii) obtaining model data (44, 44', 44'') for a model architecture (42) of a machine learning model (40, 40', 40'') for defect recognition in the imaging dataset of the wafer, the model architecture (42) being implemented in the embedded system (50); (iii) transferring the model data (44, 44', 44'') to a programmable memory (48, 48', 48'') of the embedded system (50); (iv) applying the machine learning model (40, 40', 40'') to an imaging dataset of a wafer to recognize defects, comprising executing the embedded system implemented model architecture (46) with the transferred model data (44, 44', 44'').</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Computer implemented method for defect recognition in an imaging dataset of a wafer, corresponding computer readable-medium, computer program product and systems making use of such methods |
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