Improving chemistry utilization by increasing pressure during substrate processing

A substrate processing system comprises a processing chamber comprising a pedestal configured to support a substrate. The processing chamber comprises a showerhead configured to supply precursors during dose steps and a purge gas during purge steps of an atomic layer deposition (ALD) process to proc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RICHEY, NATHANIEL ELBA, BHIMARASETTI, GOPINATH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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