Glass substrate, multilayer wiring substrate, and glass substrate manufacturing method

The present invention provides a glass substrate in which it is possible to form a through-electrode having favorable adhesion. To achieve this, the glass substrate of the present invention has a first surface and a second surface, and includes at least one through-hole penetrating from the first su...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SAWADAISHI, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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