Glass substrate, multilayer wiring substrate, and glass substrate manufacturing method

The present invention provides a glass substrate in which it is possible to form a through-electrode having favorable adhesion. To achieve this, the glass substrate of the present invention has a first surface and a second surface, and includes at least one through-hole penetrating from the first su...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SAWADAISHI, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	The present invention provides a glass substrate in which it is possible to form a through-electrode having favorable adhesion. To achieve this, the glass substrate of the present invention has a first surface and a second surface, and includes at least one through-hole penetrating from the first surface to the second surface, the glass substrate being characterized in that the dispersion roughness of the side surface shape on a cut surface of the through-hole in the thickness direction of the glass substrate is 1,500 nm or greater, and the unevenness width is 1,500 nm or greater.