Integrated circuit packages and methods

An integrated circuit package including integrated circuit dies and a method of forming are provided. The integrated circuit package may include a first integrated circuit die, an insulating layer along sidewalls of the first integrated circuit die, and a second integrated circuit die bonded to the first integrated circuit die. The first integrated circuit die may include a first substrate, a first interconnect structure on a front side of the first substrate, and a first bonding layer on the first interconnect structure, the first interconnect structure being between the first bonding layer and the first substrate. The second integrated circuit die may include a second substrate, a second interconnect structure on a front side of the second substrate, and a second bonding layer on the second interconnect structure, the second interconnect structure being between the second bonding layer and the second substrate. A first surface of the first bonding layer may be in direct contact with a first surface of the s