Substrate processing method, processing head, and substrate processing device

The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJISAWA, MAO, KASHIWAGI, MAKOTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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