Substrate processing method, processing head, and substrate processing device

The present invention relates to a substrate processing method for processing a substrate. The substrate processing method includes processing a processed surface (5a) of a substrate (W) by rotating the substrate (W) about an axis thereof, pressing a processing tape (2A) against the processed surface (5a) of the substrate (W) by means of a pressing member (12) of a processing head (10A) while feeding the processing tape (2A) in a longitudinal direction thereof, in a state in which the pressing member (12) is inclined in a first direction (D1) relative to a prescribed pressing direction (CL), and then pressing the processing tape (2A) against the processed surface (5a) by means of the pressing member (12) in a state in which the pressing member (12) is inclined relative to the pressing direction (CL) in a second direction (D2) opposite to the first direction (D1), the first direction (D1) and the second direction (D2) being directions in the longitudinal direction of the processing tape (2A) on the pressing me