Touch pad module and computer using the same

The present invention discloses a touch pad module, which is applied to an electronic computer. The casing of the electronic computer has an inwardly recessed frame. The frame includes a sidewall and bearing part extending from the sidewall. The touch pad module is disposed in the frame, and the touch pad module includes a touch panel assembly and at least one pressure sensing element. The touch panel assembly includes an upper cover plate and a circuit board. The peripheral end of the upper cover plate against the bearing part of the frame. The pressure sensing element is disposed on the touch panel assembly and electrically connected to the circuit board. When the touch panel assembly is pressed by an external force, the contact point between the peripheral end of the upper cover plate and the bearing part is used as a fulcrum to sunken down and have a deformation amount. The pressure sensing element senses the touch force exerted on the touch panel assembly according to the deformation amount and outputs a