Thermally conductive silicone composition

Provided is a thermally conductive silicone composition having excellent thermal conductivity, applicability, slippage resistance, and crack resistance. The thermally conductive silicone composition contains (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and a kinematic v...

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Bibliographische Detailangaben
1. Verfasser:	AKIBA, SHOTA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES FUELS INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATINGCOMPOSITIONS LUBRICANTS LUBRICATING COMPOSITIONS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PEAT PETROLEUM, GAS OR COKE INDUSTRIES POLISHES TECHNICAL GASES CONTAINING CARBON MONOXIDE THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a thermally conductive silicone composition having excellent thermal conductivity, applicability, slippage resistance, and crack resistance. The thermally conductive silicone composition contains (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and a kinematic viscosity at 25 DEG C of from 10 to 50,000 mm2/s, (B) an organohydrogenpolysiloxane (in an amount to make the molar ratio (Si-H/Si-Vi) of alkenyl groups bonded to silicon atoms (Si-Vi) in component (A) and Si-H groups in component (B) be 1 to 20), (C) an organopolysiloxane having a kinematic viscosity at 25 DEG C of 80,000 mm2/s or more, (D) a silicone oil free of aliphatic unsaturated bonds and Si-H groups and having a kinematic viscosity at 25 DEG C of less than 80,000 mm2/s, (E) a thermally conductive inorganic filler having an average particle size of 3 [mu]m or less, and (F) a thermally conductive inorganic filler having an average particle size of 5 [mu]m or more.