Prepreg, laminated plate, printed wiring board, and semiconductor package

Provided is a prepreg for which adhesiveness between prepregs is reduced despite containing a compound that has a structural unit derived from a conjugated diene compound. The prepreg is specifically a prepreg that has surface roughness and that contains a thermosetting resin composition containing...

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Bibliographische Detailangaben
Hauptverfasser:	IWANAGA, KOHTA, NAKAMURA, SHOTA, UENO, FUMITAKA, NAKAMURA, YUKIO, MATSUOKA, SHIORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a prepreg for which adhesiveness between prepregs is reduced despite containing a compound that has a structural unit derived from a conjugated diene compound. The prepreg is specifically a prepreg that has surface roughness and that contains a thermosetting resin composition containing (A) a thermosetting resin and (B) a compound having a structural unit (b1) derived from a conjugated diene compound or a half-cured product of the thermosetting resin composition. The proportion of depressions in the surface roughness is 30-90%.