Protective sheet for semiconductor processing, and method for manufacturing semiconductor device

Provided is a protective sheet for semiconductor processing, the protective sheet comprising a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic re...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SASAKI, KAZUHIRO, NAODA, KOJI, YUMOTO, KEITA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Provided is a protective sheet for semiconductor processing, the protective sheet comprising a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic resin (A1) not containing an ethylenically unsaturated group, and a crosslinking agent (B1), and the adhesive layer is a cured product of an adhesive composition comprising an ethylenically unsaturated group-containing (meth)acrylic resin (A2), a crosslinking agent (B2), and a photopolymerization initiator (C). The (meth)acrylic resin (A1) not containing an ethylenically unsaturated group has a plurality of functional groups that react with functional groups of the crosslinking agent (B1), and the ethylenically unsaturated group-containing (meth)acrylic resin (A2) has a plurality of functional groups that react with functional groups of the crosslinking agent (B2). The ethylenically unsaturated group-containing (meth