Protective sheet for semiconductor processing, and method for manufacturing semiconductor device
Provided is a protective sheet for semiconductor processing, the protective sheet comprising a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic re...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided is a protective sheet for semiconductor processing, the protective sheet comprising a substrate, and an intermediate layer and an adhesive layer in this order on one main surface of the substrate. The intermediate layer is a cured product of a resin composition comprising a (meth)acrylic resin (A1) not containing an ethylenically unsaturated group, and a crosslinking agent (B1), and the adhesive layer is a cured product of an adhesive composition comprising an ethylenically unsaturated group-containing (meth)acrylic resin (A2), a crosslinking agent (B2), and a photopolymerization initiator (C). The (meth)acrylic resin (A1) not containing an ethylenically unsaturated group has a plurality of functional groups that react with functional groups of the crosslinking agent (B1), and the ethylenically unsaturated group-containing (meth)acrylic resin (A2) has a plurality of functional groups that react with functional groups of the crosslinking agent (B2). The ethylenically unsaturated group-containing (meth |
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