Copper foil attached to carrier foil and copper clad laminate using the same

Disclosed is a carrier foil-attached copper foil having favorable peel strength under high-temperature pressing conditions, the carrier foil-attached copper foil including: a carrier foil; a release layer on the carrier foil; a heat-resistant layer on the release layer; and an ultra-thin copper foil...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, HYUNGOL, SONG, KI-DEOK, KIM, GEUL-HAN, YANG, CHANG-YOL, BEOM, WON-JIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a carrier foil-attached copper foil having favorable peel strength under high-temperature pressing conditions, the carrier foil-attached copper foil including: a carrier foil; a release layer on the carrier foil; a heat-resistant layer on the release layer; and an ultra-thin copper foil on the heat-resistant layer, wherein a buffer layer of a Ni alloy is interposed between the release layer and the heat-resistant layer.