Lead frame and package method
The present invention provides a lead frame, which includes: a die pad and a plurality of lead pads, the die pad having a die disposing area, the lead pads being located around the die pad; an outer frame, connected to outside of the die pad and the lead pads; and at least two tie bars, connected be...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention provides a lead frame, which includes: a die pad and a plurality of lead pads, the die pad having a die disposing area, the lead pads being located around the die pad; an outer frame, connected to outside of the die pad and the lead pads; and at least two tie bars, connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie rods, has a thermal deformation mitigation structure. |
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