Substrate treatment apparatus and treatment solution supply method

A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatm...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUDO, KAZUYA, ICHINO, KATSUNORI, OGATA, MAKOTO, HASHIMOTO, KATSUYA, TANAKA, MASATAKA
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KUDO, KAZUYA
ICHINO, KATSUNORI
OGATA, MAKOTO
HASHIMOTO, KATSUYA
TANAKA, MASATAKA
description A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202427557A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202427557A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202427557A3</originalsourceid><addsrcrecordid>eNrjZHAKLk0qLilKLElVKClKTSzJTc0rUUgsKEgECpUWKyTmpSCJF-fnlJZk5ucpFJcWFORUKuSmlmTkp_AwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkviQcCMDIxMjc1NTc0djYtQAAMiQM1U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate treatment apparatus and treatment solution supply method</title><source>esp@cenet</source><creator>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</creator><creatorcontrib>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</creatorcontrib><description>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</description><language>chi ; eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240701&amp;DB=EPODOC&amp;CC=TW&amp;NR=202427557A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240701&amp;DB=EPODOC&amp;CC=TW&amp;NR=202427557A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDO, KAZUYA</creatorcontrib><creatorcontrib>ICHINO, KATSUNORI</creatorcontrib><creatorcontrib>OGATA, MAKOTO</creatorcontrib><creatorcontrib>HASHIMOTO, KATSUYA</creatorcontrib><creatorcontrib>TANAKA, MASATAKA</creatorcontrib><title>Substrate treatment apparatus and treatment solution supply method</title><description>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKLk0qLilKLElVKClKTSzJTc0rUUgsKEgECpUWKyTmpSCJF-fnlJZk5ucpFJcWFORUKuSmlmTkp_AwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkviQcCMDIxMjc1NTc0djYtQAAMiQM1U</recordid><startdate>20240701</startdate><enddate>20240701</enddate><creator>KUDO, KAZUYA</creator><creator>ICHINO, KATSUNORI</creator><creator>OGATA, MAKOTO</creator><creator>HASHIMOTO, KATSUYA</creator><creator>TANAKA, MASATAKA</creator><scope>EVB</scope></search><sort><creationdate>20240701</creationdate><title>Substrate treatment apparatus and treatment solution supply method</title><author>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202427557A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDO, KAZUYA</creatorcontrib><creatorcontrib>ICHINO, KATSUNORI</creatorcontrib><creatorcontrib>OGATA, MAKOTO</creatorcontrib><creatorcontrib>HASHIMOTO, KATSUYA</creatorcontrib><creatorcontrib>TANAKA, MASATAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDO, KAZUYA</au><au>ICHINO, KATSUNORI</au><au>OGATA, MAKOTO</au><au>HASHIMOTO, KATSUYA</au><au>TANAKA, MASATAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate treatment apparatus and treatment solution supply method</title><date>2024-07-01</date><risdate>2024</risdate><abstract>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202427557A
source esp@cenet
subjects APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title Substrate treatment apparatus and treatment solution supply method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T14%3A41%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUDO,%20KAZUYA&rft.date=2024-07-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202427557A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true