Substrate treatment apparatus and treatment solution supply method
A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatm...
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creator | KUDO, KAZUYA ICHINO, KATSUNORI OGATA, MAKOTO HASHIMOTO, KATSUYA TANAKA, MASATAKA |
description | A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202427557A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202427557A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202427557A3</originalsourceid><addsrcrecordid>eNrjZHAKLk0qLilKLElVKClKTSzJTc0rUUgsKEgECpUWKyTmpSCJF-fnlJZk5ucpFJcWFORUKuSmlmTkp_AwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkviQcCMDIxMjc1NTc0djYtQAAMiQM1U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate treatment apparatus and treatment solution supply method</title><source>esp@cenet</source><creator>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</creator><creatorcontrib>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</creatorcontrib><description>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</description><language>chi ; eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240701&DB=EPODOC&CC=TW&NR=202427557A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240701&DB=EPODOC&CC=TW&NR=202427557A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDO, KAZUYA</creatorcontrib><creatorcontrib>ICHINO, KATSUNORI</creatorcontrib><creatorcontrib>OGATA, MAKOTO</creatorcontrib><creatorcontrib>HASHIMOTO, KATSUYA</creatorcontrib><creatorcontrib>TANAKA, MASATAKA</creatorcontrib><title>Substrate treatment apparatus and treatment solution supply method</title><description>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKLk0qLilKLElVKClKTSzJTc0rUUgsKEgECpUWKyTmpSCJF-fnlJZk5ucpFJcWFORUKuSmlmTkp_AwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkviQcCMDIxMjc1NTc0djYtQAAMiQM1U</recordid><startdate>20240701</startdate><enddate>20240701</enddate><creator>KUDO, KAZUYA</creator><creator>ICHINO, KATSUNORI</creator><creator>OGATA, MAKOTO</creator><creator>HASHIMOTO, KATSUYA</creator><creator>TANAKA, MASATAKA</creator><scope>EVB</scope></search><sort><creationdate>20240701</creationdate><title>Substrate treatment apparatus and treatment solution supply method</title><author>KUDO, KAZUYA ; ICHINO, KATSUNORI ; OGATA, MAKOTO ; HASHIMOTO, KATSUYA ; TANAKA, MASATAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202427557A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDO, KAZUYA</creatorcontrib><creatorcontrib>ICHINO, KATSUNORI</creatorcontrib><creatorcontrib>OGATA, MAKOTO</creatorcontrib><creatorcontrib>HASHIMOTO, KATSUYA</creatorcontrib><creatorcontrib>TANAKA, MASATAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDO, KAZUYA</au><au>ICHINO, KATSUNORI</au><au>OGATA, MAKOTO</au><au>HASHIMOTO, KATSUYA</au><au>TANAKA, MASATAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate treatment apparatus and treatment solution supply method</title><date>2024-07-01</date><risdate>2024</risdate><abstract>A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | Substrate treatment apparatus and treatment solution supply method |
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