Substrate treatment apparatus and treatment solution supply method

A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatm...

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Bibliographische Detailangaben
Hauptverfasser:	KUDO, KAZUYA, ICHINO, KATSUNORI, OGATA, MAKOTO, HASHIMOTO, KATSUYA, TANAKA, MASATAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate treatment apparatus includes: a plurality of solution treatment modules stacked at multiple stages, each configured to perform a treatment using a treatment solution on a substrate; and a solution supply unit configured to supply the treatment solution to the plurality of solution treatment modules, wherein: the solution supply unit includes supply pipelines provided with a solution feeder corresponding to the solution treatment modules; and the solution feeder includes a pump configured to pressure-feed the treatment solution to the corresponding solution treatment module and a filter configured to filtrate the treatment solution, and is arranged adjacent to the corresponding solution treatment module in a horizontal direction.