Thermally conductive board

A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The co...

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Bibliographische Detailangaben
1. Verfasser:	LO, KUOANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The conductive filler includes a glass fiber dispersed in the electrically insulation matrix. The glass fiber has a first dielectric component and a second dielectric component. The first dielectric component is halogen. If the total weight of the glass fiber is calculated as 100%, the halogen accounts for above 0.05%. The second dielectric component is an element of titanium group. If the total weight of the glass fiber is calculated as 100%, the element of titanium group accounts for above 0.03%.