Bond protection for an electrostatic chuck in a plasma processing chamber

An electrostatic chuck system for use in a plasma processing chamber is provided. A conductive base plate is provided. A bond of a bonding material is bonded to a surface of the base plate on a first side of the bond. A ceramic plate is bonded to a second side of the bond. A protective strip surroun...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KONDEKAR, NEHA, YU, YIXUAN, SAMULON, ERIC, PURANDARE, MORESHWAR NARAYAN, MITROVIC, SLOBODAN, NARENDRNATH, KADTHALA R
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electrostatic chuck system for use in a plasma processing chamber is provided. A conductive base plate is provided. A bond of a bonding material is bonded to a surface of the base plate on a first side of the bond. A ceramic plate is bonded to a second side of the bond. A protective strip surrounds the bond and extends between the conductive base plate and the ceramic plate, wherein the protective strip comprises at least one of an anodized strip, a ceramic tape strip, and a coated aluminum strip.