System for testing semiconductor device

A system, for testing a plurality of semiconductor devices, includes a pressing apparatus, a carrying apparatus and an abutting apparatus. The pressing apparatus includes a cover and a seat. The cover and the seat constitute a test chamber and a sealed auxiliary chamber. The carrying apparatus is placed in the test chamber. Each semiconductor device is carried by one of a plurality of test sockets of the carrying apparatus. The abutting apparatus is placed between the cover and the test sockets of the carrying apparatus. The auxiliary chamber is pumped through at least one extraction hole, such that the pressure in the auxiliary chamber is lowered to drive the cover to move towards the seat to apply force to the abutting apparatus. The abutting apparatus with applied force presses against the plurality of test sockets and the plurality of semiconductor devices, such that each test socket is in electrical contact with the semiconductor device carried by said one test socket.