Ceramic board structure and power module

Ceramic board structure and power module

A ceramic board structure includes a ceramic substrate, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic substrate has a first surface and a second surface opposite to each other. The first conductive layer and the second conductive layer are disposed on...

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Bibliographische Detailangaben
Hauptverfasser: HUANG, MENGI, CHOU, MINIEH, HUANG, YUE-ZHEN, KAO, TUNE-HUNE, CHEN, JIEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Beschreibung
Zusammenfassung:A ceramic board structure includes a ceramic substrate, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic substrate has a first surface and a second surface opposite to each other. The first conductive layer and the second conductive layer are disposed on the first surface of the ceramic substrate, and the second conductive layer is disposed adjacent to the first conductive layer. The first conductive layer and the second conductive layer have different thickness. The heat dissipation layer is disposed on the second surface of the ceramic substrate. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer. The second heat dissipation portion has a patterning region.