Nano-twinned ultrathin metallic film structure and methods for forming the same

A nano-twinned ultrathin metallic film structure is provided, including: a substrate; and a nano-twinned metallic film on the surface of the substrate, wherein the nano-twinned metallic film has a thickness of 0.5[mu]m to 3[mu]m, and the nano-twinned metallic film has a transition layer near the sub...

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Bibliographische Detailangaben
1. Verfasser:	CHUANG, CHIEN-HSUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CRYSTAL GROWTH DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY NANOTECHNOLOGY PERFORMING OPERATIONS PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:	A nano-twinned ultrathin metallic film structure is provided, including: a substrate; and a nano-twinned metallic film on the surface of the substrate, wherein the nano-twinned metallic film has a thickness of 0.5[mu]m to 3[mu]m, and the nano-twinned metallic film has a transition layer near the substrate and a twin layer away from the substrate, the twin layer accounts for at least 70% of the thickness of the nano-twinned metallic film, and has a parallel-arranged twin boundary, and the parallel-arranged twin boundary includes more than 50% (111) crystal orientation, wherein the nano-twinned metallic film includes silver, copper, gold, palladium or nickel. The nano-twinned ultrathin metallic structure is formed by activating the substrate surface by ion beam bombardment, followed by performing a sputtering process on the activated substrate surface with a substrate bias.