Substrate processing apparatus and substrate processing method
To provide a technique that enables a reduction in an operation of a substrate processing apparatus and shortening of a time taken by substrate processing. A substrate processing apparatus comprises: a holding part for holding a substrate; a liquid supply part for supplying, to a main surface of the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | To provide a technique that enables a reduction in an operation of a substrate processing apparatus and shortening of a time taken by substrate processing. A substrate processing apparatus comprises: a holding part for holding a substrate; a liquid supply part for supplying, to a main surface of the substrate held by the holding part, a first processing liquid and a second processing liquid, which is different from the first processing liquid, in order; a friction body that, during the supply of the first processing liquid and the second processing liquid, contacts the main surface of the substrate and rubs the main surface; a moving part for moving a contact position of the friction body, at which it contacts the main surface of the substrate, in a first axial direction and a second axial direction that are parallel to the main surface of the substrate and cross each other; and a control part for controlling the liquid supply part and the moving part so that the contact position of the friction body is moved |
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