Member for semiconductor manufacturing apparatus

A member 10 for a semiconductor manufacturing apparatus includes: a ceramic plate 20; a composite plate 30 joined to the lower surface of the ceramic plate 20; a cooling plate 50 disposed on the lower surface of the composite plate 30; first fasteners 60 that fasten the composite plate 30 and the cooling plate 50 together; a support plate 70 that supports the lower surface of the cooling plate 50; and second fasteners 80 that fasten the cooling plate 50 and the support plate 70 together. In the member 10 for a semiconductor manufacturing apparatus, when the ceramic plate 20 is heated from room temperature to high temperature, a layered body (first layered body L1) composed of the ceramic plate 20 and the composite plate deforms such that a central portion of the first layered body L1 is convex, and a layered body (second layered body L2) composed of the cooling plate 50 and the support plate 70 fastened together using the second fasteners 80 also deforms such that a central portion of the second layered body