Process fluid treatment apparatus, wafer cleaning apparatus and semiconductor manufacturing equipment including the same

The present invention provides a process fluid treatment apparatus, a wafer cleaning apparatus and semiconductor manufacturing equipment capable of decomposing ozone from a process fluid more effectively. A process fluid treatment apparatus for processing a process fluid used for cleaning a wafer in a semiconductor manufacturing equipment according to the present invention includes a housing, a spray nozzle and a nozzle heating member. The housing forms an inner space for accommodating the process fluid. The spray nozzle sprays a process fluid containing ozone into the inner space in the form of a mist. The nozzle heating member heats the process fluid sprayed through the spray nozzle.