Rolled copper foil, copper-clad laminate, method for manufacturing copper-clad laminate, method for manufacturing flexible printed circuit board, and method for manufacturing electronic part

Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being una...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHO, SHUNSUKE, OTA, AKIMITSU, NAKAGAWA, KOTARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370 DEG C for a soak time of 1 sec.