Substrate processing apparatus

A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second clean...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YASHIMA, TETSUYA, YAMAGUCHI, KUNIAKI, INABA, MITSUHIKO, ISOBE, SOICHI, MAEDA, KOJI, AONO, HIROSHI, SHINKAI, KENJI, SHIMOMOTO, HIROSHI, ISOKAWA, HIDETATSU, NAKAO, HIDETAKA, HASHIMOTO, KOICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL CONVEYING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS POLISHING PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.