Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate and the second substrate has a first surface orientation. The first IC die is spaced apart from the second IC die. A third die electrically interconnects t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HSIEH, TSUNG-YANG, CHUANG, YAOUN, WU, JYUN-LIN, KAO, CHIN-FU, LIN, YU-SHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A first integrated circuit (IC) die includes a first substrate. A second IC die includes a second substrate. At least one of the first substrate and the second substrate has a first surface orientation. The first IC die is spaced apart from the second IC die. A third die electrically interconnects the first IC die to the second IC die. The third die includes a third substrate having a second surface orientation. The second surface orientation is different from the first surface orientation.