Semiconductor processing equipment and wafer lifting apparatus thereof for improving the guidance of the up-and-down vertical movement and reducing the jamming of the lift pin, thereby reducing the breakage rate of the wafer and improving the product yield

A semiconductor processing equipment and a wafer lifting apparatus thereof are disclosed. A wafer lifting apparatus disposed in a reaction chamber of the semiconductor processing equipment includes a plurality of lifting assemblies that pass through the through holes on the electrostatic chuck and are arranged under the wafer. The lifting assembly includes a mounting flange located below the through hole; a central shaft passing through a mounting through hole of the mounting flange, in which a lift pin is installed on the top of the central shaft; a bellow sleeved on the central shaft; a sleeve sleeved on the outer side of the bellow; and a cylinder disposed on the outer side of the sleeve and bellow. In the present invention, the overall length of the lifting assembly is shortened by reasonably setting the lengths of the sleeve and the cylinder, thereby shortening the relative movement distance between the sleeve and the cylinder when the lift pin is raised and lowered, thereby reducing the probability of t