Carbon-based direct plating process

Carbon-based direct plating process

A method of preparing a non-conductive substrate to allow metal plating thereon and a two-part gel coating composition. The method includes the steps of (a) contacting the non-conductive substrate with a conditioner comprising a high molecular weight conditioning agent; (b) applying a carbon-based d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: BERNARDS, ROGER
Format: Patent
Sprache:chi ; eng
Schlagworte:
AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE
APPARATUS THEREFOR
CHEMISTRY
CRYSTAL GROWTH
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
REFINING BY ZONE-MELTING OF MATERIAL
SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE
SINGLE-CRYSTAL-GROWTH
UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:A method of preparing a non-conductive substrate to allow metal plating thereon and a two-part gel coating composition. The method includes the steps of (a) contacting the non-conductive substrate with a conditioner comprising a high molecular weight conditioning agent; (b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises adhesive carbon or graphite particles dispersed in a liquid solution; and (c) etching the non-conductive substrate. The adhesive carbon black or graphite particles in the liquid-carbon based dispersion have a small particle size and a tight particle size distribution.