Fluid supply mechanism and fluid supply method

A fluid supply mechanism 100 repeatedly supplies and stops fluid to a chamber CH. The fluid supply mechanism 100 includes: a fluid supply path L1 that communicates with the chamber 100; a tank T which is disposed on the fluid supply path L1 and into which fluid is introduced; and a downstream valve...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIWAKI, KEISUKE, YADA, HIDETAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A fluid supply mechanism 100 repeatedly supplies and stops fluid to a chamber CH. The fluid supply mechanism 100 includes: a fluid supply path L1 that communicates with the chamber 100; a tank T which is disposed on the fluid supply path L1 and into which fluid is introduced; and a downstream valve Vd that is disposed downstream of the tank T in the fluid supply path, and changes the internal volume through deformation.