Resin composition, cured product, semiconductor element, and dry film resist

The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating temperature that is lower than 100 DEG C. This resin compositio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEDA, MAO, TSUBAMOTO, MAI, IIZUKA, MASAYUKI, YAMAMOTO, KAZUYOSHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that has excellent compatibility, that can be cured by means of light, and that requires less heating time and an additional heating temperature that is lower than 100 DEG C. This resin composition contains: a bismaleimide compound (A) that is obtained by reacting an aromatic diamine (a-1) represented by formula (1), a tetrabasic acid dianhydride (a-3), and maleic acid anhydride, and that has a cyclic imide bond; a resin or compound (B) having an ethylenically unsaturated group; and a photocuring initiator (C). (Each R1 independently represents a hydrogen atom, a linear or branched alkyl group having 1-6 carbon atoms, a halogen atom, a hydroxy group, or a linear or branched alkoxy group having 1-6 carbon atoms. Each l independently represents an integer of 1-4.).