Resin composition, cured product, semiconductor element, and dry film resist

The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200 DEG C or higher, and has a low dielectric dissipation factor. This resin composition comprises: (A) a bismaleimide compo...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA, MAO, TSUBAMOTO, MAI, IIZUKA, MASAYUKI, YAMAMOTO, KAZUYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a bismaleimide compound-containing resin composition that can be patterned with light, has a glass transition temperature of 200 DEG C or higher, and has a low dielectric dissipation factor. This resin composition comprises: (A) a bismaleimide compound that is obtained by reacting an aromatic diamine (a-1) represented by formula (1), a tetrabasic acid dianhydride (a-3), and maleic anhydride and that has a cyclic imide linkage; and (B) a maleimide compound other than the bismaleimide compound (A).